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[Technical Column] Issue 15: Cooling Mechanism of Inverters

As the power of electric vehicles increases, the heat dissipation of the inverter also increases, requiring a high-performance cooling system!

In this column, I will discuss the cooling mechanisms of inverters. The cooling mechanisms of inverters include single-sided cooling, as shown on the left of the diagram, and double-sided cooling, as shown on the right. In the case of single-sided cooling, semiconductor devices are soldered to a substrate, which is then joined to a heat sink made of ceramic materials with good thermal conductivity and insulation, such as aluminum nitride, and cooled through a cooling channel. In this case, to cool the semiconductor substrate from one side, a number of semiconductor chips are arranged on a flat structure and cooled from one side. *For more detailed information on the column, please refer to the related links. If you have any questions, feel free to contact us.*

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